Product Specifications

High-Certainty 3D Inspection for Advanced SMT Production

The MIRTEC MV-6 OMNI is designed for manufacturers that cannot afford ambiguity in inspection results. In high-mix, fine-pitch, and densely populated PCB environments, image quality alone is not enough. What matters is inspection certainty: the ability to distinguish true defects from acceptable process variation, and to do so consistently at production speed. This is where the MV-6 OMNI stands apart.

At the core of this Mirtec 3D AOI platform is Omni-Vision 3D technology, an advanced 8-projection digital Moire fringe method that captures precise height and shape information across components and solder joints. Instead of relying only on surface appearance, the system builds accurate 3D measurement data, making it far more effective when evaluating solder volume, coplanarity, lifted leads, insufficient solder, and other defects that can be difficult to judge with conventional 2D methods.

Why Omni-Vision 3D Improves Inspection Confidence

The practical advantage of Omni-Vision 3D is not just higher technical sophistication; it is better decision-making on the line. By using 8 projected fringe patterns, the system collects dense and reliable 3D data from multiple perspectives. This strengthens defect detection on challenging assemblies where reflective surfaces, component shadowing, or complex solder geometries may reduce confidence in simpler inspection approaches.

• Accurate 3D measurement of component geometry
• Reliable volumetric evaluation of solder joints
• Stronger discrimination between real defects and cosmetic variation
• Improved repeatability for demanding SMT inspection programs

For process engineers, this means fewer false calls to review, more stable quality control, and clearer feedback for upstream printing and placement optimization. For quality teams, it means a more dependable basis for defect containment before boards move downstream.

Ultra-High-Resolution Imaging That Reveals More

A major strength of the MIRTEC MV-6 OMNI is its use of a 15MP or 25MP CoaXPress Camera system. In real factory conditions, ultra-high resolution directly influences inspection certainty. Fine solder fillets, minute lead deformation, polarity marking clarity, and subtle surface anomalies all become easier to identify when the optical system provides sharper, richer detail.

The high-speed CoaXPress architecture also supports fast image transfer without compromising image integrity. This is especially valuable for manufacturers balancing throughput targets with strict quality requirements. The result is a 3D AOI System that offers both visual depth and production practicality.

1. Higher image clarity for tiny feature recognition
2. Better defect visibility on dense or miniature assemblies
3. Fast acquisition suited to inline SMT production
4. Greater consistency when inspecting complex solder conditions

Comprehensive Coverage with Optional Side-View Cameras

Boards with tall components, connectors, or partially hidden joints often require more than a top-down view. The optional 10MP or 18MP side-view cameras expand coverage to support near 360-degree inspection capability. This is particularly useful for connector pins, gull-wing leads, and solder areas obscured from vertical imaging paths.

For manufacturers producing automotive electronics, industrial controls, communications hardware, or other assemblies with demanding interconnect verification needs, this added visibility can materially improve coverage and reduce escape risk.

Built for Fine-Pitch and Miniature Components

The MV-6 OMNI supports precision telecentric lens options of 10um, 15um, and 18um, enabling inspection down to 03015 components. This matters in modern SMT lines where miniaturization is no longer limited to premium devices. As component sizes continue to shrink, inspection systems must maintain measurement integrity without sacrificing usability. The telecentric optics help preserve dimensional accuracy across the field of view, supporting stable results on small and densely arranged components.

Software That Supports Real Production Needs

Hardware performance is only valuable when paired with software that operators and engineers can use efficiently. Mirtec’s Intelligys software is designed to simplify programming and accelerate image processing, helping teams deploy recipes faster and manage inspection tasks with less friction. In facilities where product changeovers are frequent, this can translate into smoother introductions, faster optimization, and better control over inspection standards.

Who Benefits from This System

This Mirtec AOI solution is well suited for electronics manufacturers that need stronger defect detection on fine-pitch, high-density, or quality-critical assemblies. It is a strong fit for:

• EMS providers managing diverse product mixes
• OEM factories seeking tighter solder joint verification
• Manufacturers transitioning to more advanced 3D AOI workflows
• Quality-driven operations aiming to reduce false calls and escapes

Supply Confidence from SMT MALLS

SMT MALLS has served the electronics manufacturing sector since 2009 as a one-stop source for SMT equipment and spare parts. With deep industry experience, more than 200 full production lines delivered across Europe, South America, and Asia, and a large ready-to-ship inventory of original parts from major brands, we understand what production buyers and engineers expect: verified condition, technical clarity, and dependable support.

Our working principle, “Investigation before Quotation,” reflects that commitment. Every equipment recommendation is grounded in practical review, and every delivery is supported with test videos and technical assistance to help ensure reliable performance. For customers evaluating the MV-6 OMNI, that means a sourcing process built around transparency and reduced risk.

If your line requires a 3D AOI System that combines measurement depth, ultra-high-resolution imaging, and application-ready software, the MIRTEC MV-6 OMNI offers a compelling balance of precision, speed, and real-world inspection certainty.